Datasheet

Data Sheet AD8000
Rev. B | Page 17 of 20
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-012-AA
06-02-2011-B
1.27
0.40
1.75
1.35
2.29
2.29
0.356
0.457
4.00
3.90
3.80
6.20
6.00
5.80
5.00
4.90
4.80
0.10 MAX
0.05 NOM
3.81 REF
0.25
0.17
8°
0°
0.50
0.25
45°
COPLANARITY
0.10
1.04 REF
8
1
4
5
1.27 BSC
SEATING
PLANE
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
TOP VIEW
0.51
0.31
1.65
1.25
Figure 54. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]
Narrow Body (RD-8-1)
Dimensions shown in millimeters and (inches)
1
EXPOSED
PAD
(BOTTOM VIEW)
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
5
8
PIN 1
INDICATOR
SEATING
PLANE
0.30
0.23
0.18
0.60 MAX
0.60 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
04-04-2012-A
Figure 55. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding Ordering Quantity
AD8000YRDZ –40°C to +125°C 8-Lead SOIC_N_EP RD-8-1 1
AD8000YRDZ-REEL –40°C to +125°C 8-Lead SOIC_N_EP RD-8-1 2,500
AD8000YRDZ-REEL7
–40°C to +125°C
8-Lead SOIC_N_EP
RD-8-1
1,000
AD8000YCPZ-R2 –40°C to +125°C 8-Lead LFCSP_VD CP-8-2 HNB 250
AD8000YCPZ-REEL –40°C to +125°C 8-Lead LFCSP_VD CP-8-2 HNB 5,000
AD8000YCPZ-REEL7 –40°C to +125°C 8-Lead LFCSP_VD CP-8-2 HNB 1,500
AD8000YCPZ-EBZ Evaluation Board
AD8000YRD-EBZ Evaluation Board
1
Z = RoHS Compliant Part.