Datasheet

AD7986
Rev. B | Page 27 of 28
OUTLINE DIMENSIONS
2.65
2.50 SQ
2.35
3.75
BSC SQ
4.00
BSC SQ
COMPLIANT
TO
JEDEC STANDARDS MO-220-VGGD-1
090408-B
1
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
20
6
16
10
11
15
5
EXPOSED
PAD
(BOTTOM VIEW)
0.60 MAX
0.60 MAX
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2, 3
Temperature Range Package Description
Package
Option
Ordering
Quantity
AD7986BCPZ −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Tray CP-20-4 490
AD7986BCPZ-RL7 −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ], 7” Tape and Reel CP-20-4 1,500
EVAL-AD7986EBZ Evaluation Board
EVAL-CED1Z Converter Evaluation and Development Board
1
Z = RoHS Compliant Part.
2
The EVAL-AD7986EBZ can be used as a standalone evaluation board or in conjunction with the EVAL-CED1Z for evaluation/demonstration purposes.
3
The EVAL-CED1Z allows a PC to control and communicate with all Analog Devices evaluation boards ending in the EB designator.