Datasheet

AD7938-6 Data Sheet
Rev. C | Page 30 of 32
3.25
3.10 SQ
2.95
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
1
32
8
9
25
24
17
16
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
S
EATING
PLANE
0.50
0.40
0.30
5.00
BSC SQ
4.75
BSC SQ
0.60 MAX
0.60 MAX
0.25 MIN
05-25-2011-A
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
Figure 46. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
0.45
0.37
0.30
0.80
7.00
BSC SQ
9.00 BSC SQ
BSC
LEAD PITCH
1
24
25
32
8
9
17
16
1.20
MAX
0.75
0.60
0.45
1.05
1.00
0.95
0.20
0.09
0.08 MAX
COPLANARITY
SEATING
PLANE
0° MIN
7°
3.5°
0°
0.15
0.05
VIEW A
ROTATED 90° CCW
VIEW A
PIN 1
TOP VIEW
(PINS DOWN)
020607-A
COMPLIANT TO JEDEC STANDARDS MS-026-AB A
Figure 47. 32-Lead Thin Plastic Quad Flat Package [TQFP]
(SU-32-2)
Dimensions shown in millimeters