Datasheet

AD7887
Rev. D | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to AGND −0.3 V to +7 V
Analog Input Voltage to AGND −0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to AGND −0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to AGND −0.3 V to V
DD
+ 0.3 V
REF
IN
/REF
OUT
to AGND −0.3 V to V
DD
+ 0.3 V
Input Current to Any Pin Except Supplies
1
±10 mA
Operating Temperature Range
Commercial Temperature Range
A, B Versions −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature +150°C
SOIC or MSOP Package Power Dissipation 450 mW
θ
JA
Thermal Impedance 157°C/W (SOIC)
205.9°C/W (MSOP)
θ
JC
Thermal Impedance 56°C/W (SOIC)
43.74°C/W (MSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
Pb-Free Temperature, Soldering Reflow 260(0)°C
ESD 4 kV
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION