Datasheet

AD7879/AD7889
Rev. C | Page 6 of 40
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameter Rating
V
CC
to GND −0.3 V to +3.6 V
Analog Input Voltage to GND −0.3 V to V
CC
+ 0.3 V
AUX/VBAT to GND −0.3 V to +5 V
Digital Input Voltage to GND −0.3 V to V
CC
+ 0.3 V
Digital Output Voltage to GND −0.3 V to V
CC
+ 0.3 V
Input Current to Any Pin Except Supplies
1
10 mA
ESD Rating (X+, Y+, X−, Y−)
Air Discharge Human Body Model 15 kV
Contact Human Body Model 10 kV
ESD Rating (All Other Pins)
Human Body Discharge 4 kV
Field-Induced Charged Device Model 1 kV
Machine Model 0.2 kV
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Power Dissipation
WLCSP (4-Layer Board) 866 mW
LFCSP (4-Layer Board) 2.138 W
IR Reflow Peak Temperature 260°C (±0.5°C)
Lead Temperature (Soldering 10 sec) 300°C
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
1
θ
JA
Unit
12-Ball WLCSP 75 °C/W
16-Lead LFCSP 30.4 °C/W
1
4-layer board.
200µA I
OL
200µA I
OH
1.4V
TO OUTPUT
PIN
C
L
50pF
07667-004
Figure 4. Circuit Used for Digital Timing
ESD CAUTION