Datasheet

AD7879/AD7889
Rev. C | Page 38 of 40
OUTLINE DIMENSIONS
120808-A
A
B
C
D
1
2
3
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.36
0.32
0.28
0.17
0.15
0.13
1.50
REF
BALL 1
IDENTIFIER
SEATING
PLANE
0.50
REF
0.37
0.35
0.33
0.28
0.24
0.20
0.10 MAX
COPLANARITY
1.67
1.61
1.55
2.07
2.01
1.95
0.65
0.59
0.53
Figure 47. 12-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-12-1)
Dimensions shown in millimeters
010410-A
A
B
C
D
0.650
0.59
5
0.540
1.555
1.505
1
.455
2.055
2.005
1.955
1
2
3
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE D
OWN)
0.340
0.320
0.300
1.50
REF
BALL 1
I
DENTIFIER
SEATING
PLANE
1.00
REF
0.50
REF
0.380
0.355
0.330
0 .040 MAX
0.020 MIN
0.270
0.240
0.210
0.10 MAX
COPLANARITY
Figure 48. 12-Ball, Backside-Coated Wafer Level Chip Scale Package [WLCSP]
(CB-12-5)
Dimensions shown in millimeters
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATOR
TOP
VIEW
4.00
BSC SQ
3.75
BSC SQ
COPLANARITY
0.08
EXPOSED
PAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.35
0.30
0.25
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
0.50
0.40
0.30
0.25 MIN
2.50
2.35 SQ
2.20
082008-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 49. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm, Very Thin Quad
(CP-16-10)
Dimensions shown in millimeters