Datasheet

AD7873 Data Sheet
Rev. F | Page 6 of 28
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
+V
CC
to GND –0.3 V to +7 V
Analog Input Voltage to GND –0.3 V to V
CC
+ 0.3 V
Digital Input Voltage to GND –0.3 V to V
CC
+ 0.3 V
Digital Output Voltage to GND –0.3 V to V
CC
+ 0.3 V
V
REF
to GND –0.3 V to V
CC
+ 0.3 V
Input Current to Any Pin Except Supplies
1
±10 mA
Operating Temperature Range
Commercial (A, B Versions) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
Junction Temperature 150°C
Power Dissipation 450 mW
IR Reflow Soldering
Peak Temperature
220°C (±5°C)
Time-to-Peak Temperature 10 sec to 30 sec
Ramp-Down Rate 6°C/sec max
Pb-free Parts Only
Peak Temperature 250°C
Time-to-Peak Temperature
20 sec to 40 sec
Ramp-Up Rate 3°C/sec max
Ramp-Down Rate 6°C/sec max
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
16-Lead QSOP 149.97 38.8 °C/W
16-Lead TSSOP 150.4 27.6 °C/W
16-Lead LFCSP 135.7 °C/W
ESD CAUTION