Datasheet

REV. B
–32–
AD7858/AD7858L
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
24-Lead Plastic DIP (N-24)
24
112
13
0.260 0.001
(6.61 0.03)
PIN 1
1.228 (31.19)
1.226 (31.14)
SEATING
PLANE
0.02 (0.5)
0.016 (0.41)
0.07 (1.78)
0.05 (1.27)
0.32 (8.128)
0.30 (7.62)
0.011 (0.28)
0.009 (0.23)
0.130 (3.30)
0.128 (3.25)
0.11 (2.79)
0.09 (2.28)
15
0
NOTES
1. LEAD NO. 1 IDENTIFIED BY A DOT OR NOTCH.
2. PLASTIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead Small Outline Package (R-24)
24
13
121
0.608 (15.45)
0.596 (15.13)
0.414 (10.52)
0.398 (10.10)
0.299 (7.6)
0.291 (7.39)
PIN 1
SEATING
PLANE
0.01 (0.254)
0.006 (0.15)
0.019 (0.49)
0.014 (0.35)
0.096 (2.44)
0.089 (2.26)
0.05
(1.27)
BSC
0.013 (0.32)
0.009 (0.23)
0.042 (1.067)
0.018 (0.447)
6
0
0.03 (0.76)
0.02 (0.51)
NOTES
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN A
CCO
RDAN
C
E WITH MIL-M-
385
1
0
RE
QU
IREMENT
S
.
24-Lead Shrink Small Outline Package (RS-24)
24
1
13
12
0.328 (8.33)
0.318 (8.08)
0.311 (7.9)
0.301 (7.64)
0.212 (5.38)
0.205 (5.207)
PIN 1
SEATING
PLANE
0.008 (0.203)
0.002 (0.050)
0.07 (1.78)
0.066 (1.67)
0.0256
(0.65)
BSC
0.015 (0.38)
0.010 (0.25)
0.009 (0.229)
0.005 (0.127)
0.037 (0.94)
0.022 (0.559)
8
0
NOTES
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
C01337–0–6/00
PRINTED IN U.S.A.