Datasheet

AD7843
Rev. B | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
+V
CC
to GND −0.3 V to +7 V
Analog Input Voltage to GND −0.3 V to V
CC
+ 0.3 V
Digital Input Voltage to GND −0.3 V to V
CC
+ 0.3 V
Digital Output Voltage to GND −0.3 V to V
CC
+ 0.3 V
V
REF
to GND −0.3 V to V
CC
+ 0.3 V
Input Current to Any Pin Except Supplies
1
±10 mA
Operating Temperature Range
Commercial −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
QSOP, TSSOP Package, Power Dissipation 450 mW
θ
JA
Thermal Impedance 149.97°C/W (QSOP)
150.4°C/W (TSSOP)
θ
JC
Thermal Impedance 38.8°C/W (QSOP)
27.6°C/W (TSSOP)
IR Reflow Soldering
Peak Temperture
Time-to-Peak Temperture
Ramp-Down Rate
220°C (±5°C)
10 sec to 30 sec
6°C/sec max
Pb-free parts only
Peak Temperture 250°C
Time-to-Peak Temperture
Ramp-Up Rate
Ramp-Down Rate
20 sec to 40 sec
3°C/sec max
6°C/sec max
________________
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Rating
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.