Datasheet

AD7834/AD7835
Rev. D | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. V
CC
must not exceed V
DD
by more than
0.3 V. If it is possible for this to happen during power supply sequencing, the diode protection scheme shown in
Figure 5 can be used to
provide protection.
Table 5.
AD7834/
AD7835
V
DD
V
CC
IN4148
SD103C
V
DD
V
CC
01006-005
Parameter Rating
V
CC
to DGND −0.3 V to +7 V, or V
DD
+ 0.3 V
(whichever is lower)
V
DD
to AGND −0.3 V to +17 V
V
SS
to AGND +0.3 V to –17 V
Figure 5. Diode Protection
AGND to DGND −0.3 V to +0.3 V
−0.3 V to V
CC
+ 0.3 V Digital Inputs to DGND
THERMAL RESISTANCE
V
REF
(+) to V
REF
(–) −0.3 V to +18 V
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
V
REF
(+) to AGND V
SS
– 0.3 V to V
DD
+ 0.3 V
V
REF
(–) to AGND V
SS
– 0.3 V to V
DD
+ 0.3 V
V
SS
– 0.3 V to V
DD
+ 0.3 V DSG to AGND
Table 6. Thermal Resistance
V
OUT
(1–4) to AGND V
SS
– 0.3 V to V
DD
+ 0.3 V
Package Type θ
JA
Unit
Operating Temperature Range, T
A
PDIP 75 °C/W
−40°C to +85°C Industrial (A Version)
SOIC 75 °C/W
−65°C to +150°C Storage Temperature Range
MQFP 95 °C/W
150°C Junction Temperature, T
J
(max)
PLCC 55 °C/W
Power Dissipation, P
D
(max) (T
J
− T
A
)/θ
JA
Lead Temperature JEDEC Industry Standard
ESD CAUTION
Soldering J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.