Datasheet

AD7822/AD7825/AD7829
Rev. C | Page 6 of 28
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to AGND −0.3 V to +7 V
V
DD
to DGND −0.3 V to +7 V
Analog Input Voltage to AGND
V
IN1
to V
IN8
−0.3 V to V
DD
+ 0.3 V
Reference Input Voltage to AGND −0.3 V to V
DD
+ 0.3 V
V
MID
Input Voltage to AGND −0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to DGND −0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to DGND −0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
PDIP Package, Power Dissipation 450 mW
θ
JA
Thermal Impedance 105°C/W
Lead Temperature, (Soldering, 10 sec) 260°C
SOIC Package, Power Dissipation 450 mW
θ
JA
Thermal Impedance 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
TSSOP Package, Power Dissipation 450 mW
θ
JA
Thermal Impedance 128°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
ESD 1 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.