Datasheet

Data Sheet AD780
ABSOLUTE MAXIMUM RATINGS
analog.com Rev. J | 4 of 12
Table 2.
Parameter Values
+V
IN
to Ground 36 V
TRIM Pin to Ground 36 V
TEMP Pin to Ground 36 V
Power Dissipation (25°C) 500 mW
Storage Temperature −65°C to +150°C
Lead Temperature (Soldering 10
sec)
300°C
Output Protection Output safe for indefinite short to ground and
momentary short to V
IN
ESD Classification Class 1 (1000 V)
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
Figure 2. Pin Configuration, 8-Lead PDIP and SOIC Packages
THERMAL RESISTANCE
Thermal performance is directly linked to PCB design and operating
environment. Careful attention to PCB thermal design is required.
Table 3. Thermal Resistance
Package Type
1
θ
JA
θ
JC
2
Unit
N-8 49.8 37.4 °C/W
R-8 160 36.8 °C/W
1
Values in Table 3 are calculated based on standard JEDEC test conditions
unless otherwise specified.
2
100 μm TIM is used for the θ
JC
test. TIM is assumed to have 3.6 W/mK.
Table 4. Die Physical Characteristics
Parameter Value Units
Die Size 67 × 96 mil
Back Grind Thickness 10 mil
Bond Pad Opening Size 89 × 136 µm
Top Metal Composition AlCu (0.5%) %
Passivation Oxynitride
Polyimide None µm
Die Marker 780
Substrate Bias GND V
Figure 3. Die Layout
NOTES
Both V
OUT
pads must be connected to the output.
Die Thickness: The standard thickness of Analog Devices, Inc.
bipolar dice is 10 mil ± 1 mil.
Die Dimensions: The dimensions given are the maximum possible
die size.
Backing: The standard backside surface is silicon (not plated).
Analog Devices does not recommend gold-backed dice for most
applications.
Edges: A diamond saw is used to separate wafers into dice,
thus providing perpendicular edges halfway through the die. In
contrast to scribed dice, this technique provides a more uniform
die shape and size. The perpendicular edges facilitate handling
(such as tweezer pickup), while the uniform shape and size simplify
substrate design and die attach.
Top Surface: The standard top surface of the die is covered by a
layer of passivation. All areas are covered except bonding pads and
scribe lines.
Surface Metallization: The metallization to Analog Devices bipolar
dice is aluminum/copper. The minimum thickness is 10,000 Å.
Bonding Pads: All bonding pads have a minimum size of 4.0 mil by
6.0 mil. The passivation windows have a minimum size of 3.5 mil by
5.3 mil.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Charged devi-
ces and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.