Datasheet

REV. C
–11–
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
28-Lead Ceramic DIP Package
(D-28)
1.42 (36.07)
1.40 (35.56)
28
1
15
14
0.59
0.01
(14.98)
+
–
0.050 (12.83)
0.085
(2.16)
0.017 0.003
(0.43)
+
–
0.1 (2.54)
0.047 0.007
(1.19)
+
–
0.095 (2.41)
0.050
0.010
(1.27)
+
–
0.6 (15.24)
0.010 0.002
(0.254 0.05)
+
–
+
–
0.145 0.02
(3.68)
+
–
0.08 (2.0)
0.125 MIN (3.17)
SEATING
PLANE
30
o
0.05 (1.27)
0.045 (1.14)
28-Lead Plastic DIP Package
(N-28)
0.195 (4.95)
0.125 (3.18)
0.015 (0.381)
0.008 (0.204)
0.625 (15.87)
0.600 (15.24)
28
114
15
PIN 1
0.580 (14.73)
0.485 (12.32)
1.565 (39.70)
1.380 (35.10)
SEATING
PLANE
0.060 (1.52)
0.015 (0.38)
0.250
(6.35)
MAX
0.022 (0.558)
0.014 (0.356)
0.200 (5.05)
0.125 (3.18)
0.150
(3.81)
MIN
0.100
(2.54)
BSC
0.070
(1.77)
MAX
28-Lead Wide Body SOIC Package
(R-28)
0.0125 (0.32)
0.0091 (0.23)
8
0
0.0291 (0.74)
0.0098 (0.25)
 45
0.0500 (1.27)
0.0157 (0.40)
SEATING
PLANE
0.0118 (0.30)
0.0040 (0.10)
0.0192 (0.49)
0.0138 (0.35)
0.1043 (2.65)
0.0926 (2.35)
0.0500
(1.27)
BSC
28 15
141
0.7125 (18.10)
0.6969 (17.70)
0.4193 (10.65)
0.3937 (10.00)
0.2992 (7.60)
0.2914 (7.40)
PIN 1
AD674B/AD774B