Datasheet

AD7715
Rev. D | Page 9 of 40
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 5.
Parameter Rating
AV
DD
to AGND −0.3 V to +7 V
AV
DD
to DGND −0.3 V to +7 V
AV
DD
to DV
DD
−0.3 V to +7 V
DV
DD
to AGND −0.3 V to +7 V
DV
DD
to DGND −0.3 V to +7 V
DGND to AGND −0.3 V to +7 V
Analog Input Voltage to AGND −0.3 V to AV
DD
+ 0.3 V
Reference Input Voltage to AGND −0.3 V to AV
DD
+ 0.3 V
Digital Input Voltage to DGND −0.3 V to DV
DD
+ 0.3 V
Digital Output Voltage to DGND −0.3 V to DV
DD
+ 0.3 V
Operating Temperature Range
Commercial (A Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Plastic DIP Package, Power Dissipation 450 mW
θ
JA
Thermal Impedance 105°C/W
Lead Temperature, (Soldering, 10 sec) 260°C
SOIC Package, Power Dissipation 450 mW
θ
JA
Thermal Impedance 75°C/W
Lead Temperature, Reflow Soldering 260°C
TSSOP Package, Power Dissipation 450 mW
θ
JA
Thermal Impedance 128°C/W
Lead Temperature, Reflow Soldering +260°C
Power Dissipation (Any Package) to +75°C 450 mW
ESD Rating >4000 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION