Datasheet

AD7714
REV. C–40–
PRINTED IN U.S.A.
C1972a–0–6/98
OUTLINE DIMENSIONS
Dimensions are shown in inches and (mm).
24-Lead Plastic DIP
(N-24)
24
112
13
0.260 ± 0.001
(6.61 ± 0.03)
PIN 1
1.228 (31.19)
1.226 (31.14)
0.11 (2.79)
0.016 (2.28)
SEATING
PLANE
0.02 (0.5)
0.019 (0.41)
0.130 (3.30)
0.128 (7.62)
0.07 (1.78)
0.05 (1.27)
0.32 (8.128)
0.30 (7.62)
0.011 (0.28)
0.009 (0.23)
158
0
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead Wide Body SOIC
(R-24)
24
13
12
1
0.608 (15.45)
0.596 (15.13)
0.414 (10.52)
0.398 (10.10)
0.299 (7.6)
0.291 (7.39)
PIN 1
SEATING
PLANE
0.01 (0.254)
0.006 (0.15)
0.019 (0.49)
0.014 (0.35)
0.096 (204)
0.089 (2.26)
0.05 (1.27)
BSC
0.013 (0.32)
0.009 (0.23)
0.0500 (1.27)
0.0157 (0.40)
88
08
0.03 (0.76)
0.02 (0.51)
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
28-Lead Shrink Small Outline Package SSOP
(RS-28)
0.009 (0.229)
0.005 (0.127)
0.03 (0.762)
0.022 (0.558)
88
08
0.008 (0.203)
0.002 (0.050)
0.07 (1.79)
0.066 (1.67)
SEATING
PLANE
0.0256 (0.65)
BSC
0.311 (7.9)
0.301 (7.64)
0.212 (5.38)
0.205 (5.207)
28 15
141
0.407 (10.34)
0.397 (10.08)
PIN 1
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead Thin Shrink Small Outline Package TSSOP
(RU-24)
24 13
12
1
0.311 (7.90)
0.303 (7.70)
0.256 (6.50) 0.246 (6.25)
0.177 (4.50) 0.169 (4.30)
PIN 1
SEATING
PLANE
0.006 (0.15)
0.002 (0.05)
0.0118 (0.30)
0.0075 (0.19)
0.0256 (0.65)
BSC
0.0433
(1.10)
MAX
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
88
08