Datasheet

AD7707
Rev. B | Page 9 of 52
ABSOLUTE MAXIMUM RATINGS
T
A
= +25°C, unless otherwise noted.
Table 5.
Parameter Rating
AV
DD
to AGND −0.3 V to +7 V
AV
DD
to DGND −0.3 V to +7 V
DV
DD
to AGND −0.3 V to +7 V
DV
DD
to DGND −0.3 V to +7 V
AV
DD
to DV
DD
−0.3 V to +7 V
DGND to AGND −0.3 V to +0.3 V
AIN1, AIN2 Input Voltage to LOCOM −0.3 V to AV
DD
+ 0.3 V
AIN3 Input Voltage to HICOM −11 V to +30 V
VBIAS to AGND −0.3 V to AV
DD
+ 0.3 V
HICOM, LOCOM to AGND −0.3 V to AV
DD
+ 0.3 V
REF IN(+), REF IN(−) to AGND −0.3 V to AV
DD
+ 0.3 V
Digital Input Voltage to DGND −0.3 V to DV
DD
+ 0.3 V
Digital Output Voltage to DGND −0.3 V to DV
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
SOIC Package, Power Dissipation 450 mW
θ
JA
Thermal Impedance 75°C/W
Lead Temperature, Soldering
Reflow 260°C
TSSOP Package, Power Dissipation 450 mW
θ
JA
Thermal Impedance 139°C/W
Lead Temperature, Soldering
Reflow 260°C
ESD Rating 2.5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION