Datasheet

AD7688
Rev. A | Page 6 of 28
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 5.
Parameter Rating
Analog Inputs
IN+
1
, IN−
1
GND − 0.3 V to VDD + 0.3 V
or ±130 mA
REF GND − 0.3 V to VDD + 0.3 V
Supply Voltages
VDD, VIO to GND −0.3 V to +7 V
VDD to VIO ±7 V
Digital Inputs to GND −0.3 V to VIO + 0.3 V
Digital Outputs to GND −0.3 V to VIO + 0.3 V
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Lead Temperature Range JEDEC J-STD-20
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
10-Lead QFN (LFCSP) 48.7 2.96 °C
10-Lead MSOP 200 44 °C
1
See the Analog Input section.
ESD CAUTION
500μAI
OL
500μAI
OH
1.4V
TO SDO
C
L
50pF
02973-003
Figure 3. Load Circuit for Digital Interface Timing
30% VIO
70% VIO
2V OR VIO – 0.5V
1
0.8V OR 0.5V
2
0.8V OR 0.5V
2
2V OR VIO – 0.5V
1
t
DELAY
t
DELAY
02973-004
1
2V IF VIO ABOVE 2.5V, VIO– 0.5V IF VIO BELOW 2.5V.
2
0.8V IF VIO ABOVE 2.5V, 0.5V IF VIO BELOW 2.5V.
Figure 4. Voltage Levels for Timing