Datasheet

AD7656-1/AD7657-1/AD7658-1 Data Sheet
Rev. D | Page 10 of 32
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 5.
Parameter Rating
V
DD
to AGND, DGND −0.3 V to +16.5 V
V
SS
to AGND, DGND +0.3 V to −16.5 V
V
DD
to AV
CC
V
CC
− 0.3 V to +16.5 V
AV
CC
to AGND, DGND −0.3 V to +7 V
DV
CC
to AV
CC
−0.3 V to AV
CC
+ 0.3 V
DV
CC
to DGND, AGND −0.3 V to +7 V
AGND to DGND
−0.3 V to +0.3 V
V
DRIVE
to DGND −0.3 V to DV
CC
+ 0.3 V
Analog Input Voltage to AGND
1
V
SS
− 0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to DGND −0.3 V to V
DRIVE
+ 0.3 V
Digital Output Voltage to DGND −0.3 V to V
DRIVE
+ 0.3 V
REFIN/REFOUT to AGND −0.3 V to AV
CC
+ 0.3 V
Input Current to Any Pin Except
Supplies
2
±10 mA
Operating Temperature Range
B Version −40°C to +85°C
Y Version −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Pb/Sn Temperature, Soldering
Reflow (10 sec to 30 sec) 240(+0)°C
Pb-Free Temperature, Soldering Reflow 260(+0)°C
ESD
1.5 kV
1
If the analog inputs are driven from alternative V
DD
and V
SS
supply circuitry,
a 240 Ω series resistor should be placed on the analog inputs and Schottky
diodes should be placed in series with the V
DD
and V
SS
supplies of the
AD7656-1/AD7657-1/AD7658-1.
2
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 6. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
64-Lead LQFP 45 11 °C/W
ESD CAUTION