Datasheet

Data Sheet AD7626
Rev. B | Page 25 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
916
17
24
25
8
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
3.25
3.10 SQ
2.95
S
EATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 44. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Notes Temperature Range Package Description Package Option
2
AD7626BCPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
AD7626BCPZ-RL7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
EVAL-AD7626EDZ
3
Evaluation Board
EVAL-CED1Z
4
Converter Evaluation and Development Board
1
Z = RoHS Compliant Part.
2
Formerly the CP-32-2 package.
3
This board can be used as a standalone evaluation board or in conjunction with the EVAL-CEDIZ for evaluation/demonstration purposes.
4
This board allows the PC to control and communicate with all Analog Devices evaluation boards with model numbers ending with the ED designator.