Datasheet

AD7625 Data Sheet
Rev. A | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
Analog Inputs/Outputs
IN+, IN− to GND
1
−0.3 V to REF + 0.3 V or
±130 mA
REF
2
to GND −0.3 V to +6 V
VCM, CAP2 to GND −0.3 V to +6 V
CAP1, REFIN to GND −0.3 V to +2.7 V
Supply Voltage
VDD1
−0.3 V to +6 V
VDD2, VIO −0.3 V to +3 V
Digital Inputs to GND −0.3 V to VIO + 0.3 V
Digital Outputs to GND −0.3 V to VIO + 0.3 V
Input Current to Any Pin Except
Supplies
3
±10 mA
Operating Temperature Range
(Commercial)
−40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
ESD
1 kV
1
See the Analog Inputs section.
2
Keep CNV+/CNV− low for any external REF voltage > 4.3 V applied
to the REF pin.
3
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
32-Lead LFCSP_WQ 40 4 °C/W
ESD CAUTION