Datasheet

Data Sheet AD7606/AD7606-6/AD7606-4
Rev. C | Page 11 of 36
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameter Rating
AV
CC
to AGND −0.3 V to +7 V
V
DRIVE
to AGND −0.3 V to AV
CC
+ 0.3 V
Analog Input Voltage to AGND
1
±16.5 V
Digital Input Voltage to AGND −0.3 V to V
DRIVE
+ 0.3 V
Digital Output Voltage to AGND −0.3 V to V
DRIVE
+ 0.3 V
REFIN to AGND −0.3 V to AV
CC
+ 0.3 V
Input Current to Any Pin Except Supplies
1
±10 mA
Operating Temperature Range
B Version −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Pb/SN Temperature, Soldering
Reflow (10 sec to 30 sec) 240 (+0)°C
Pb-Free Temperature, Soldering Reflow 260 (+0)°C
ESD (All Pins Except Analog Inputs) 2 kV
ESD (Analog Input Pins Only) 7 kV
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 5. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
64-Lead LQFP 45 11 °C/W
ESD CAUTION