Datasheet

REV.
AD7564
–6–
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25°C unless otherwise noted)
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
I
OUT1
to DGND . . . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
I
OUT2
to DGND . . . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . . . –0.3 V to V
DD
+ 0.3 V
V
RFB
, V
REF
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . .±15 V
Input Current to Any Pin Except Supplies
2
. . . . . . . . ±10 mA
Operating Temperature Range
Commercial Plastic (A, B Versions). . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
DIP Package, Power Dissipation . . . . . . . . . . . . . . . . . 875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . 260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 875 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . 260°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . +220°C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . . 900 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . 100°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
PIN CONFIGURATION
DIP, SOIC and SSOP Packages
NC = NO CONNECT
DGND
I
OUT2
C
I
OUT2
B
AGND
R
FB
C
V
REF
C
I
OUT2
D
R
FB
B
V
REF
B
I
OUT2
A
V
DD
I
OUT1
C
NC
I
OUT1
B
I
OUT1
D I
OUT1
A
R
FB
D R
FB
A
V
REF
D V
REF
A
SDOUT
A0
CLR A1
LDAC OCLKIN
FSIN SDIN
13
18
1
2
28
27
5
6
7
24
23
22
3
4
26
25
821
920
10 19
1111
12 17
16
14 15
TOP VIEW
(Not to Scale)
AD7564
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7564 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
B