Datasheet

AD7564
REV. B –17–
Figure 28. 28-Lead Shrink Small Outline Package [SSOP]
(RS-28)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD7564AR-B −40°C to +85°C 28-Lead SOIC_W RW-28
AD7564ARS-B −40°C to +85°C 28-Lead SSOP RS-28
AD7564ARS-BREEL −40°C to +85°C 28-Lead SSOP RS-28
AD7564ARSZ-B −40°C to +85°C 28-Lead SSOP RS-28
AD7564ARSZ-BREEL −40°C to +85°C 28-Lead SSOP RS-28
AD7564ARZ-B −40°C to +85°C 28-Lead SOIC_W RW-28
AD7564ARZ-BREEL −40°C to +85°C 28-Lead SOIC_W RW-28
AD7564BN −40°C to +85°C 28-Lead PDIP N-28-2
AD7564BNZ −40°C to +85°C 28-Lead PDIP N-28-2
AD7564BR −40°C to +85°C 28-Lead SOIC_W RW-28
AD7564BR-REEL −40°C to +85°C 28-Lead SOIC_W RW-28
AD7564BRS −40°C to +85°C 28-Lead SSOP RS-28
AD7564BRS-REEL −40°C to +85°C 28-Lead SSOP RS-28
AD7564BRSZ −40°C to +85°C 28-Lead SSOP RS-28
AD7564BRSZ-REEL −40°C to +85°C 28-Lead SSOP RS-28
AD7564BRZ −40°C to +85°C 28-Lead SOIC_W RW-28
AD7564BRZ-REEL −40°C to +85°C 28-Lead SOIC_W RW-28
REVISION HISTORY
2/12—Rev. A to Rev. B
Changes to Pin 16 Description ....................................................... 7
Updated Outline Dimensions ....................................................... 17
Changes to Ordering Guide .......................................................... 17
COMPLIANT TO JEDEC STANDARDS MO-150-AH
060106-A
28
15
14
1
10.50
10.20
9.90
8.20
7.80
7.40
5.60
5.30
5.00
SEATING
PLANE
0.05 MIN
0.65 BSC
2.00 MAX
0.38
0.22
COPLANARITY
0.10
1.85
1.75
1.65
0.25
0.09
0.95
0.75
0.55
8°
4°
0°
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registered trademarks are the property of their respective owners.
D10540-0-2/12(B)