Datasheet

AD7475/AD7495
Rev. B | Page 9 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C unless otherwise noted.
Table 4.
Parameters Ratings
V
DD
to GND −0.3 V to +7 V
V
DRIVE
to GND −0.3 V to +7 V
Analog Input Voltage to GND −0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to GND −0.3 V to +7 V
V
DRIVE
to V
DD
−0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to GND −0.3 V to V
DRIVE
+ 0.3 V
REF IN to GND −0.3 V to V
DD
+ 0.3 V
Input Current to Any Pin Except
Supplies
1
±10 mA
Operating Temperature Range
Commercial (A, B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
SOIC, MSOP Package, Power Dissipation 450 mW
θ
JA
Thermal Impedance 157°C/W (SOIC)
205.9°C/W (MSOP)
θ
JC
Thermal Impedance 56°C/W (SOIC)
43.74°C/W (MSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
ESD 4 kV
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.