Datasheet

AD7398/AD7399
Rev. C | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
V
DD
to GND −0.3 V, +7 V
V
SS
to GND +0.3 V, −7 V
V
REF
to GND V
SS
, V
DD
Logic Inputs to GND −0.3 V, +8 V
V
OUT
to GND V
SS
− 0.3 V, V
DD
+ 0.3 V
I
OUT
Short Circuit to GND 50 mA
Thermal Resistance (θ
JA
)
16-Lead SOIC_W Package
(RW-16)
158°C/W
16-Lead TSSOP Package
(RU-16)
180°C/W
Maximum Junction
Temperature (T
J
Max)
150°C
Package Power Dissipation (T
J
Max – T
A
)/θ
JA
Operating Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Reflow Soldering Peak
Temperature
SnPb 240°C
Pb-Free 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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