Datasheet
AD73322
–10–
REV. B
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25°C unless otherwise noted)
AVDD, DVDD to GND . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Digital I/O Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V
Analog I/O Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . +150°C
SOIC, θ
JA
Thermal Impedance . . . . . . . . . . . . . . . 71.4°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
LQFP, θ
JA
Thermal Impedance . . . . . . . . . . . . . . . 53.2°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Temperature Package Package
Model Range Descriptions Options
AD73322AR –40°C to +85°C Wide Body SOIC R-28
AD73322AST –40°C to +85°C Plastic Thin Quad ST-44A
Flatpack (LQFP)
EVAL-AD73322EB Evaluation Board
1
+EZ-KIT Lite Upgrade
2
EVAL-AD73322EZ Evaluation Board
1
+EZ-KIT Lite
3
NOTES
1
The AD73322 evaluation board features a selectable number of codecs in
cascade (from 1 to 4). It can be interfaced to an ADSP-2181 EZ-KIT Lite or to
a Texas Instruments EVM kit.
2
The upgrade consists of a connector that is used to connect the EZ-KIT to the
AD73322 evaluation board. This option is intended for owners of the EZ-KIT
Lite.
3
The EZ-KIT Lite has been modified to allow it to interface with the AD73322
evaluation board. This option is intended for users who do not already have an
EZ-KIT Lite.
PIN CONFIGURATIONS
28-Lead Wide Body SOIC
(R-28)
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD73322
SDO
MCLK
SCLK
RESET
DVDD
DGND
AGND2
VINP1
VFBP1
VINN1
VFBN1
AVDD2
REFCAP
REFOUT
SDOFS
SDIFS
SDI
SE
AGND1
AVDD1
VOUTP2
VFBN2
VINN2
VFBP2
VINP2
VOUTN2
VOUTP1
VOUTN1
44-Lead Plastic Thin Quad Flatpack (LQFP)
(ST-44A)
3
4
5
6
7
1
2
10
11
8
9
40 39 3841424344 36 35 3437
29
30
31
32
33
27
28
25
26
23
24
PIN 1
IDENTIFIER
TOP VIEW
(Not to Scale)
12
13
14 15 16 17 18 19
20
21 22
NC
VOUTN1
VOUTP1
NC
VOUTN2
VOUTP2
NC
AD73322
REFOUT
REFCAP
AVDD2
AVDD2
AGND2
AGND2
AGND2
NC = NO CONNECT
AGND2
DGND
DGND
DVDD
AVDD1
SDI
NC
AVDD1
SDIFS
AGND1
AGND1
NC
VFBN1
NC
RESET
VFBP1
VINN2
VFBP2
VINP2
NC
VINP1
SCLK
MCLK
SDO
VINN1
NC
SDOFS
VFBN2
SE
NC