Datasheet

AD7294 Data Sheet
Rev. H | Page 46 of 48
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026-ABD
1.20
MAX
33
48
64
1
17
16
32
49
0.40
BSC
LEAD PITCH
0.75
0.60
0.45
9.20
9.00 SQ
8.80
7.20
7.00 SQ
6.80
0.23
0.18
0.13
TOP VIEW
(PINS DOWN)
PIN 1
VIEW A
1.05
1.00
0.95
0.20
0.09
0.08 MAX
COPLANARITY
SEATING
PLANE
0° MIN
7°
3.5°
0°
0.15
0.05
VIEW A
ROTATED 90° CCW
012108-A
Figure 62. 64-Lead Thin Plastic Quad Flat Package [TQFP]
(SU-64-1)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2
030509-A
PIN 1
INDICATOR
TOP
VIEW
7.75
BSC SQ
8.00
BSC SQ
1
56
14
15
43
42
28
29
6.25
6.10 SQ
5.95
0.50
0.40
0.30
0.30
0.23
0.18
0.50 BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
6.50
REF
SEATING
PLANE
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
COPLANARITY
0.08
0.05 MAX
0.02 NOM
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 63. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
8 mm × 8 mm body, Very Thin Quad
(CP-56-1)
Dimensions shown in millimeters