Datasheet

AD7294 Data Sheet
Rev. H | Page 10 of 48
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
1
Table 5.
Parameter Rating
V
PP
x to AGND −0.3 V to +70 V
AV
DD
x to AGND −0.3 V to +7 V
DAC OUTV+ AB to AGND −0.3 V to +17 V
DAC OUTV+ CD to AGND −0.3 V to +17 V
DV
DD
to DGND −0.3 V to +7 V
V
DRIVE
to OPGND −0.3 V to +7 V
Digital Inputs to OPGND −0.3 V to V
DRIVE
+ 0.3 V
SDA/SCL to OPGND −0.3 V to +7 V
Digital Outputs to OPGND −0.3 V to V
DRIVE
+ 0.3 V
RS(+)/RS(−) to V
PP
x V
PP
− 0.3 V to V
PP
+ 0.3 V
REF
OUT
/REF
IN
ADC to AGND −0.3 V to AV
DD
+ 0.3 V
REF
OUT
/REF
IN
DAC to AGND −0.3 V to AV
DD
+ 0.3 V
OPGND to AGND −0.3 V to +0.3 V
OPGND to DGND −0.3 V to +0.3 V
AGND to DGND −0.3 V to +0.3 V
V
OUT
x to AGND −0.3 V to DAC OUTV(+) + 0.3 V
Analog Inputs to AGND −0.3 V to AV
DD
+ 0.3 V
Operating Temperature Range
B Version −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (T
J
Max) 150°C
ESD Human Body Model 1 kV
Reflow Soldering Peak
Temperature
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
To conform with IPC 2221 industrial standards, it is advisable
to use conformal coating on the high voltage pins.
THERMAL RESISTANCE
Table 6. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
64-Lead TQFP 54 16 °C/W
56-Lead LFCSP 21 2 °C/W
ESD CAUTION
1
Transient currents of up to 100 mA do not cause SCR latch-up.