Datasheet
Table Of Contents
- Features
- Applications
- Functional Block Diagram
- General Description
- Table of Contents
- Revision History
- Specifications
- Absolute Maximum Ratings
- Pin Configuration and Function Descriptions
- Typical Performance Characteristics
- Theory of Operation
- Serial Port Interface (SPI)
- Register Structure
- Register Descriptions
- Vendor ID Register (Address 0x00)
- ADC Data Register (Address 0x01)
- ADC Sequence Register (Address 0x03)
- Configuration Register Bank (Address 0x05)
- Digital Output Driver Subregister (Address 0x01)
- Digital I/O Function Subregister (Address 0x02)
- General Subregister (Address 0x08)
- VIN RANGE0 and VIN RANGE1 Subregisters (Address 0x10 and Address 0x11)
- ADC Sampling Mode Subregister (Address 0x12)
- VIN ALERT0 Routing and VIN ALERT1 Routing Subregisters (Address 0x13 and Address 0x14)
- VIN Filter Subregister (Address 0x15)
- Conversion Delay Control Subregister (Address 0x16)
- Temperature Sensor Subregister (Address 0x20)
- Temperature Sensor Alert Routing Subregister (Address 0x21)
- GPIO2/DAC DISABLE0 and GPIO4/DAC DISABLE1 Subregisters (Address 0x30 and Address 0x31)
- Alert Limits Register Bank (Address 0x06)
- Alert Flags Register Bank (Address 0x07)
- Minimum and Maximum Register Bank (Address 0x08)
- Offset Register Bank (Address 0x09)
- DAC Buffer Enable Register (Address 0x0A)
- GPIO Register (Address 0x0B)
- Conversion Command Register (Address 0x0E)
- ADC Conversion Result Registers, VIN0 to VIN7 (Address 0x10 to Address 0x17)
- TSENSE Conversion Result Register (Address 0x20)
- DAC Channel Registers (Address 0x30 to Address 0x33)
- ADC Conversion Control
- DAC Output Control
- Alerts and Limits
- Outline Dimensions

Data Sheet AD7292
Rev. 0 | Page 7 of 40
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 6.
Parameter Rating
AV
DD
to A
GND
−0.3 V to +6 V
DV
DD
to D
GND
−0.3 V to +6 V
V
DRIVE
to D
GND
−0.3 V to +6 V
VINx to A
GND
−0.3 V to AV
DD
+ 0.3 V
VOUTx to A
GND
−0.3 V to AV
DD
+ 0.3 V
Digital Inputs/Outputs to D
GND
−0.3 V to DV
DD
+ 0.3 V
CS
, SCLK, DIN, DOUT to D
GND
−0.3 V to V
DRIVE
+ 0.3 V
REF
OUT
to A
GND
−0.3 V to +2.2 V
REF
IN
to A
GND
−0.3 V to AV
DD
+ 0.3 V
D
GND
to A
GND
0.3 V
Operating Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (T
J
max) 150°C
ESD, Human Body Model 2.5 kV
Reflow Soldering Peak Temperature 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 7. Thermal Resistance
Package Type θ
JA
Unit
36-Lead LFCSP 54.1 °C/W
ESD CAUTION










