Datasheet

AD7280A
Rev. 0 | Page 7 of 48
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameter Rating
V
DD
to V
SS
, AGND −0.3 V to +33 V
V
SS
to AGND, DGND −0.3 V to +0.3 V
VIN0 to VIN5 Voltage to V
SS
, AGND V
SS
− 0.3 V to V
DD
+ 0.3 V
VIN6 Voltage to V
SS
, AGND V
DD
− 0.3 V to V
DD
+ 1 V
CB1 Output to V
SS
, AGND −0.3 V to DV
CC
+ 0.3 V
CBx Output to VIN(x − 1)
1
−0.3 V to VIN(x − 1)
1
+ 7 V
AUX1 to AUX6 Voltage to V
SS
, AGND −0.3 V to AV
CC
+ 0.3 V
AUX
TERM
Voltage to V
SS
, AGND −0.3 V to AV
CC
+ 0.3 V
AV
CC
to V
SS
, AGND, DGND −0.3 V to +7 V
DV
CC
to AV
CC
−0.3 V to +0.3 V
DV
CC
to V
SS
, DGND −0.3 V to +7 V
V
DRIVE
to V
SS
, AGND −0.3 V to +7 V
AGND to DGND −0.3 V to +0.3 V
Digital Input Voltage to V
SS
, DGND −0.3 V to V
DRIVE
+ 0.3 V
Digital Output Voltage to V
SS
, DGND −0.3 V to V
DRIVE
+ 0.3 V
Input Current to Any Pin Except
Supply Pins
2
±10 mA
Operating Temperature Range −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Pb-Free Temperature,
Soldering Reflow
260(+0)°C
ESD 2 kV
1
x = 2 to 6.
2
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
To conform with IPC 2221 industrial standards, it is advisable
to use conformal coating on the high voltage pins.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
48-Lead LQFP (ST-48) 76.2 17 °C/W
ESD CAUTION