Datasheet

AD7266
Rev. B | Page 27 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
011708-A
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
FORPROPERCONNECTIONOF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 47. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad (CP-32-2)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-026-ABA
0.45
0.37
0.30
0.80
BSC
LEAD PITCH
7.00
BSC SQ
9.00 BSC SQ
1
24
25
32
8
9
17
16
1.20
MAX
0.75
0.60
0.45
1.05
1.00
0.95
0.20
0.09
0.08 MAX
COPLANARITY
SEATING
PLANE
0° MIN
7°
3.5°
0°
0.15
0.05
VIEW A
ROTATED 90° CCW
VIEW A
PIN 1
TOP VIEW
(PINS DOWN)
020607-A
Figure 48. 32-Lead Thin Quad Flat Package [TQFP]
(SU-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2, 3
Temperature Range Package Description Package Option
AD7266BCPZ –40°C to +125°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD7266BCPZ-REEL7 –40°C to +125°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD7266BCPZ-REEL –40°C to +125°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD7266BSUZ –40°C to +125°C 32-Lead Thin Quad Flat Package (TQFP) SU-32-2
AD7266BSUZ-REEL7 –40°C to +125°C 32-Lead Thin Quad Flat Package (TQFP) SU-32-2
AD7266BSUZ-REEL –40°C to +125°C 32-Lead Thin Quad Flat Package (TQFP) SU-32-2
EVAL-AD7266EDZ Evaluation Board
EVAL-CED1Z Control Board
1
Z = RoHS Compliant Part.
2
The EVAL-AD7266CB can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL Board for evaluation/demonstration purposes.
3
The EVAL-CED1Z controller board allows a PC to control and communicate with all Analog Devices evaluation boards whose model numbers end in ED.