Datasheet

AD7249
–3–
TIMING CHARACTERISTICS
1, 2
Limit at T
MIN
to T
MAX
Parameter (All Versions) Unit Conditions/Comments
t
1
4
200 ns min SCLK Cycle Time
t
2
15 ns min SYNC to SCLK Falling Edge Setup Time
t
3
50 ns min SYNC to SCLK Hold Time
t
4
0 ns min Data Setup Time
t
5
150 ns min Data Hold Time
t
6
0 ns min SYNC High to LDAC Low
t
7
20 ns min LDAC Pulsewidth
t
8
0 ns min LDAC High to SYNC Low
t
9
50 ns min CLR Pulsewidth
t
10
20 ns min SYNC High Time
NOTES
1
Timing specifications guaranteed by design not production tested. All input signals are specified with tr = tf = 5 ns (10% to 90% of 5 V) and timed from a voltage
level of 1.6 V.
2
See Figure 8.
3
Power supply tolerance, A Version: ± 10%; B, S Versions: ± 5%.
4
SCLK Mark/Space Ratio range is 45/55 to 55/45.
(V
DD
= +12 V to +15 V,
3
V
SS
= 0 V or –12 V to –15 V,
3
AGND = DGND = 0 V, R
L
= 2 k⍀,
C
L
= 100 pF. All specifications T
MIN
to T
MAX
unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25°C unless otherwise noted)
V
DD
to AGND, DGND . . . . . . . . . . . . . . . . . . –0.3 V to +17 V
V
SS
to AGND, DGND . . . . . . . . . . . . . . . . . . +0.3 V to –17 V
AGND to DGND . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
V
OUTA, B
2
to AGND . . . . . . . . . . . . V
SS
– 0.3 V to V
DD
+ 0.3 V
REFOUT to AGND . . . . . . . . . . . . . . . . . . . . . . . . 0 V to V
DD
REFIN to AGND . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Digital Inputs to DGND . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (A, B Versions) . . . . . . . . . . . . . . –40°C to +85°C
Extended (S Version) . . . . . . . . . . . . . . . . . –55°C to +125°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Power Dissipation Plastic DIP . . . . . . . . . . . . . . . . . . . 600 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . +117°C/W
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . +300°C
Power Dissipation, Cerdip . . . . . . . . . . . . . . . . . . . . . . 600 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . +300°C
Power Dissipation, SOIC . . . . . . . . . . . . . . . . . . . . . . . 600 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature (Soldering)
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one Absolute
Maximum Rating may be applied at any time.
2
The outputs may be shorted to voltages in this range provided the power dissipation
of the package is not exceeded.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7249 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. D