Datasheet

Data Sheet AD7193
Rev. D | Page 55 of 56
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AE
28
15
141
8°
0°
SEATING
PLANE
C
OPLANARIT
Y
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
Figure 69. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
1
0.50
BSC
3.50 REF
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
916
17
24
25
8
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
3.65
3.50 SQ
3.45
S
EATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
04-02-2012-A
Figure 70. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very, Very Thin Quad
(CP-32-11)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD7193BRUZ −40°C to +105°C 28-Lead TSSOP RU-28
AD7193BRUZ-REEL −40°C to +105°C 28-Lead TSSOP RU-28
AD7193BCPZ −40°C to +105°C 32-Lead LFCSP_WQ CP-32-11
AD7193BCPZ-RL −40°C to +105°C 32-Lead LFCSP_WQ CP-32-11
AD7193BCPZ-RL7 −40°C to +105°C 32-Lead LFCSP_WQ CP-32-11
EVAL-AD7193EBZ Evaluation Board
1
Z = RoHS Compliant Part.