Datasheet

AD7176-2 Data Sheet
Rev. A | Page 8 of 68
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
AVDD1, AVDD2 to AVSS
−0.3 V to +6.5 V
AVDD1 to DGND
−0.3 V to +6.5 V
IOVDD to DGND
−0.3 V to +6.5 V
IOVDD to AVSS
−0.3 V to +7.5 V
AVSS to DGND
−3.25 V to +0.3 V
Analog Input Voltage to AVSS
−0.3 V to AVDD1 + 0.3 V
Reference Input Voltage to AVSS
−0.3 V to AVDD1 + 0.3 V
Digital Input Voltage to DGND
−0.3 V to IOVDD + 0.3 V
Digital Output Voltage to DGND
−0.3 V to IOVDD + 0.3 V
AIN[4:0] or Digital Input Current 10 mA
Operating Temperature Range
−40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Maximum Junction Temperature 150°C
Lead Soldering, Reflow Temperature 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for a device soldered on a JEDEC test board for
surface-mount packages. The values listed in Table 4 are based
on simulated data.
Table 4. Thermal Resistance
Package Type θ
JA
Unit
24-Lead TSSOP
JEDEC Board Layer 1 156 °C/W
JEDEC Board Layer 2 87 °C/W
ESD CAUTION