Datasheet

AD6645
Rev. D | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Electrical
AV
CC
Voltage 0 V to 7 V
DV
CC
Voltage 0 V to 7 V
Analog Input Voltage 0 V to AV
CC
Analog Input Current 25 mA
Digital Input Voltage 0 V to AV
CC
Digital Output Current 4 mA
Environmental
Operating Temperature Range (Ambient)
AD6645-80 −40°C to +85°C
AD6645-105 −10°C to +85°C
Maximum Junction Temperature 150°C
Lead Temperature (Soldering, 10 sec) 300°C
Storage Temperature Range (Ambient) −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The heat sink of the AD6645ASVZ, 52-lead TQFP_EP (SV-52-1)
package must be soldered to the PCB GND plane to meet thermal
specifications.
Table 6. Thermal Characteristics
Package Type Rating
52-Lead TQFP_EP
θ
JA
(0 m/sec airflow)
1, 2, 3
23°C/W, soldered heat sink
θ
JMA
(1.0 m/sec airflow)
2, 3, 4, 5
17°C/W, soldered heat sink
θ
JC
6, 7
2°C/W, soldered heat sink
52-Lead LQFP_PQ4
θ
JA
(0 m/sec airflow)
1, 2, 3
30°C/W, unsoldered heat sink
θ
JMA
(1.0 m/sec airflow)
2, 3, 4, 5
24°C/W, unsoldered heat sink
θ
JA
(0 m/sec airflow)
1, 2, 3
23°C/W, soldered heat sink
θ
JMA
(1.0 m/sec airflow)
2, 3, 4, 5
17°C/W, soldered heat sink
θ
JC
6, 7
2°C/W
1
Per JEDEC JESD51-2 (heat sink soldered to PCB).
2
2S2P JEDEC test board.
3
Values of θ
JA
are provided for package comparison and PCB design
considerations.
4
Per JEDEC JESD51-6 (heat sink soldered to PCB).
5
Airflow increases heat dissipation, effectively reducing θ
JA
. Furthermore, the
more metal that is directly in contact with the package leads from metal
traces, throughholes, ground, and power planes, the more θ
JA
is reduced.
6
Per MIL-STD-883, Method 1012.1.
7
Values of θ
JC
are provided for package comparison and PCB design
considerations when an external heat sink is required.
Values of θ
JA
are provided for package comparison and PCB
design considerations. θ
JA
can be used for a first-order
approximation of T
J
by the equation
T
J
= T
A
+ (θ
JA
× PD)
where:
T
A
is the ambient temperature (°C).
PD is the power dissipation (W).
EXPLANATION OF TEST LEVELS
I. 100% production tested.
II. 100% production tested at 25°C and guaranteed by design
and characterization at temperature extremes.
III. Sample tested only.
IV. Parameter is guaranteed by design and characterization
testing.
V. Parameter is a typical value only.
ESD CAUTION