Datasheet
Data Sheet AD632
Rev. D | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 2. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
10-Lead TO-100 150 25 °C/W
14-Lead SBDIP 95 25 °C/W