Datasheet

AD620
Rev. H | Page 18 of 20
AD620ACHIPS INFORMATION
Die size: 1803 μm × 3175 μm
Die thickness: 483 μm
Bond Pad Metal: 1% Copper Doped Aluminum
To minimize gain errors introduced by the bond wires, use Kelvin connections between the chip and the gain resistor, R
G
, by connecting
Pad 1A and Pad 1B in parallel to one end of R
G
and Pad 8A and Pad 8B in parallel to the other end of R
G
. For unity gain applications
where R
G
is not required, Pad 1A and Pad 1B must be bonded together as well as the Pad 8A and Pad 8B.
1A
1B
2
3
4
5
6
7
8A
8B
LOGO
00775-0-053
Figure 49. Bond Pad Diagram
Table 6. Bond Pad Information
Pad Coordinates
1
Pad No. Mnemonic
X (μm) Y (μm)
1A R
G
−623 +1424
1B R
G
−789 +628
2 −IN −790 +453
3 +IN −790 −294
4 −V
S
−788 −1419
5 REF +570 −1429
6 OUTPUT +693 −1254
7 +V
S
+693 +139
8A R
G
+505 +1423
8B R
G
+693 +372
1
The pad coordinates indicate the center of each pad, referenced to the center of the die. The die orientation is indicated by the logo, as shown in Figure 49.
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.