Datasheet

AD606
REV. B
–3–
ORDERING GUIDE
Temperature Package Package
Model Range Description Option
AD606JN 0°C to +70°C 16-Lead Plastic DIP N-16
AD606JR 0°C to +70°C 16-Lead Narrow-Body R-16A
SOIC
AD606JR-REEL 0°C to +70°C 13" Tape and Reel R-16A
AD606JR-REEL7 0°C to +70°C 7" Tape and Reel R-16A
AD606-EB Evaluation Board
AD606JCHIPS 0°C to +70°C Die
PIN DESCRIPTION
Plastic DIP (N)
and
Small Outline (R)
Packages
TOP VIEW
(Not to Scale)
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
INLO INHI
AD606
COMM COMM
ISUM PRUP
ILOG VPOS
BFIN FIL1
VLOG FIL2
OPCM LADJ
LMLO LMHI
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage V
POS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . +9 V
Internal Power Dissipation
2
. . . . . . . . . . . . . . . . . . . 600 mW
Operating Temperature Range . . . . . . . . . . . . . 0°C to +70°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
16-Lead Plastic DIP Package: θ
JA
= 85°C/W
16-Lead SOIC Package: θ
JA
= 100°C/W
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD606 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
PIN FUNCTION DESCRIPTIONS
Pin Mnemonic Function
1 INLO DIFFERENTIAL RF INPUT
–75 dBm to +5 dBm, Inverting, AC Coupled.
2 COMM POWER SUPPLY COMMON
Connect to Ground.
3 ISUM LOG DETECTOR SUMMING NODE
4 ILOG LOG CURRENT OUTPUT
Normally No Connection; 2 µA/dB Output
Current.
5 BFIN BUFFER INPUT
Optionally Used to Realize Low Frequency
Post-Demodulation Filters.
6 VLOG BUFFERED LOG OUTPUT
37.5 mV/dB (100 mV to 4.5 V).
7 OPCM OUTPUT COMMON
Connect to Ground.
8 LMLO DIFFERENTIAL LIMITER OUTPUT
1.2 mA Full-Scale Output Current. Open
Collector Output Must Be “Pulled” Up to
VPOS with R ≤ 400 Ω.
9 LMHI DIFFERENTIAL LIMITER OUTPUT
1.2 mA Full-Scale Output Current. Open
Collector Output Must Be “Pulled” Up to
VPOS with R ≤ 400 Ω.
10 LADJ LIMITER LEVEL ADJUSTMENT
Optionally Used to Adjust Limiter Output
Current.
11 FIL1 OFFSET LOOP LOW-PASS FILTER
Normally No Connection; a Capacitor Between
FIL1 and FIL2 May Be Added to Lower the
Filter Cutoff Frequency.
12 FIL2 OFFSET LOOP LOW-PASS FILTER
Normally No Connection; See Above.
13 VPOS POSITIVE SUPPLY
Connect to +5 V at 13 mA.
14 PRUP POWER UP
CMOS (5 V) Logical High = Device On
(≈ 65 mW).
CMOS (0 V) Logical Low = Device Off
(≈ 325 µW).
15 COMM POWER SUPPLY COMMON
Connect to Ground.
16 INHI DIFFERENTIAL RF INPUT
–75 dBm to +5 dBm, Noninverting, AC-Coupled.
WARNING!
ESD SENSITIVE DEVICE