Datasheet

AD5933 Data Sheet
Rev. E | Page 40 of 40
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-150-AC
060106-A
16
9
8
1
6.50
6.20
5.90
8.20
7.80
7.40
5.60
5.30
5.00
SEATING
PLANE
0.05 MIN
0.65 BSC
2.00 MAX
0.38
0.22
COPLANARITY
0.10
1.85
1.75
1.65
0.25
0.09
0.95
0.75
0.55
8°
4°
0°
Figure 43. 16-Lead Shrink Small Outline Package [SSOP]
(RS-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Temperature Range Package Description Package Option
AD5933YRSZ −40°C to +125°C 16-Lead Shrink Small Outline Package (SSOP) RS-16
AD5933YRSZ-REEL7 −40°C to +125°C 16-Lead Shrink Small Outline Package (SSOP) RS-16
AD5933WYRSZ-REEL7 −40°C to +125°C 16-Lead Shrink Small Outline Package (SSOP) RS-16
EVAL-AD5933EBZ −40°C to +125°C Evaluation Board
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The AD5933W models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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D05324-0-5/13(E)