Datasheet

AD5760 Data Sheet
Rev. D | Page 28 of 28
OUTLINE DIMENSIONS
04-11-2012-B
BOTTOM VIEWTOP VIEW
0.30
0.25
0.20
1.00
0.90
0.80
1
7
8
12
13
19
20
24
5.00 BSC
4.00 BSC
PIN 1
INDICATOR
(Chamfer 0.225)
3.75
3.65
3.50
2.75
2.65
2.50
EXPOSED
PAD
SEATING
PLANE
PIN 1
INDICATOR
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.50
BSC
0.50
0.40
0.30
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 54. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 5 mm, Very Thin Quad
(CP-24-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range INL Package Description Package Option
AD5760BCPZ −40°C to +125°C ±0.5 LSB 24-Lead LFCSP_VQ CP-24-5
AD5760BCPZ-REEL7 −40°C to +125°C ±0.5 LSB 24-Lead LFCSP_VQ CP-24-5
AD5760ACPZ −40°C to +125°C ±2 LSB 24-Lead LFCSP_VQ CP-24-5
AD5760ACPZ-REEL7 −40°C to +125°C ±2 LSB 24-Lead LFCSP_VQ CP-24-5
EVAL-AD5760SDZ Evaluation Board
1
Z = RoHS Compliant Part.
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D09650-0-7/13(D)