Datasheet

AD5757 Data Sheet
Rev. D | Page 44 of 44
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
0.25 MIN
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50 REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
SEATING
PLANE
PIN 1
INDICATOR
7.25
7.10 SQ
6.95
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
9.10
9.00 SQ
8.90
8.85
8.75 SQ
8.65
06-13-2012-C
Figure 67. 64-
Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Resolution (Bits) Temperature Range Package Description Package Option
AD5757ACPZ 16 −40°C to +105°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-3
AD5757ACPZ-REEL7 16 −40°C to +105°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-3
EVAL-AD5757SDZ Evaluation Board
1
Z = RoHS Compliant Part.
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D09225-0-11/12(D)