Datasheet

AD5724/AD5734/AD5754
Rev. D | Page 30 of 32
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-ADT
061708-A
24
13
121
6.40 BSC
0.15
0.05
0.10 COPLANARITY
TOP VIEW
EXPOSED
PAD
(Pins Up)
BOTTOM VIEW
4.50
4.40
4.30
7.90
7.80
7.70
1.20 MAX
1.05
1.00
0.80
0.65
BSC
0.30
0.19
SEATING
PLANE
0.20
0.09
8°
0°
0.75
0.60
0.45
5.02
5.00
4.95
3.25
3.20
3.15
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 45. 24-Lead Thin Shrink Small Outline Package, Exposed Pad [TSSOP_EP]
(RE-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Resolution (Bits) Temperature Range TUE INL Package Description Package Option
AD5724AREZ 12 −40°C to +85°C 0.3% FSR ±1 LSB 24-Lead TSSOP_EP RE-24
AD5724AREZ-REEL7 12 −40°C to +85°C 0.3% FSR ±1 LSB 24-Lead TSSOP_EP RE-24
AD5734AREZ 14 −40°C to +85°C 0.3% FSR ±4 LSB 24-Lead TSSOP_EP RE-24
AD5734AREZ-REEL7 14 −40°C to +85°C 0.3% FSR ±4 LSB 24-Lead TSSOP_EP RE-24
AD5754AREZ 16 −40°C to +85°C 0.3% FSR ±16 LSB 24-Lead TSSOP_EP RE-24
AD5754AREZ-REEL7 16 −40°C to +85°C 0.3% FSR ±16 LSB 24-Lead TSSOP_EP RE-24
AD5754BREZ 16 −40°C to +85°C 0.1% FSR ±16 LSB 24-Lead TSSOP_EP RE-24
AD5754BREZ-REEL7 16 −40°C to +85°C 0.1% FSR ±16 LSB 24-Lead TSSOP_EP RE-24
1
Z = RoHS Compliant Part.