Datasheet

Data Sheet AD5751
Rev. B | Page 31 of 32
OUTLINE DIMENSIONS
3.25
3.10 SQ
2.95
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
1
32
8
9
25
24
17
16
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
S
EATING
PLANE
0.50
0.40
0.30
4.75
BSC SQ
0.60 MAX
0.60 MAX
0.25 MIN
10-02-2013-A
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
5.10
5.00 SQ
4.90
Figure 58. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD5751ACPZ −40°C to +105°C 32-Lead LFCSP_VQ CP-32-2
AD5751ACPZ-REEL7 −40°C to +105°C 32-Lead LFCSP_VQ CP-32-2
AD5751BCPZ −40°C to +105°C 32-Lead LFCSP_VQ CP-32-2
AD5751BCPZ-REEL7 −40°C to +105°C 32-Lead LFCSP_VQ CP-32-2
1
Z = RoHS Compliant Part.