Datasheet
AD574A
REV. B–4–
ORDERING GUIDE
Resolution Max
Temperature Linearity Error No Missing Codes Full Scale
Model
1
Range Max (T
MIN
to T
MAX
)(T
MIN
to T
MAX
) T.C. (ppm/°C)
AD574AJ(X) 0°C to +70°C ±1 LSB 11 Bits 50.0
AD574AK(X) 0°C to +70°C ±1/2 LSB 12 Bits 27.0
AD574AL(X) 0°C to +70°C ±1/2 LSB 12 Bits 10.0
AD574AS(X)
2
–55°C to +125°C ±1 LSB 11 Bits 50.0
AD574AT(X)
2
–55°C to +125°C ±1 LSB 12 Bits 25.0
AD574AU(X)
2
–55°C to +125°C ±1 LSB 12 Bits 12.5
NOTES
1
X = Package designator. Available packages are: D (D-28) for all grades. E (E-28A) for J and K grades and /883B processed S, T
and U grades. N (N-28) for J, K, and L grades. P (P-28A) for PLCC in J, K grades. Example: AD574AKN is K grade in plastic DIP.
2
For details on grade and package offerings screened in accordance with MIL-STD-883, refer to Analog Devices Military Products
Databook.
1
14
28
15
2
3
4
5
6
7
8
9
10
11
12
13
27
26
25
24
23
22
21
20
19
18
17
16
CONTROL
CLOCK
SAR
3
S
T
A
T
E
O
U
T
P
U
T
B
U
F
F
E
R
S
MSB
N
I
B
B
L
E
N
I
B
B
L
E
N
I
B
B
L
E
LSB
10V
REF
12
12
C
B
A
12
AD574A
3k
19.95k
9.95k
5k
5k
N
DAC
V
EE
8k
I
REF
COMP
DIGITAL COMMON
DC
I
DAC
I
DAC
=
4 x N x I
REF
+5V SUPPLY
V
LOGIC
DATA MODE SELECT
12/8
STATUS
STS
DB11
MSB
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
LSB
DIGITAL
DATA
OUTPUTS
CHIP SELECT
CS
BYTE ADDRESS/
SHORT CYCLE
A
O
READ/CONVERT
R/C
CHIP ENABLE
CE
+12/+15V SUPPLY
V
CC
+10V REFERENCE
REF OUT
ANALOG COMMON
AC
REFERENCE INPUT
REF IN
-12/-15V SUPPLY
V
EE
BIPOLAR OFFSET
BIP OFF
10V SPAN INPUT
10V
IN
20V SPAN INPUT
20V
IN
AD574A Block Diagram and Pin Configuration
ABSOLUTE MAXIMUM RATINGS*
(Specifications apply to all grades, except where noted)
V
CC
to Digital Common . . . . . . . . . . . . . . . . . .0 V to +16.5 V
V
EE
to Digital Common . . . . . . . . . . . . . . . . . . . 0 V to –16.5 V
V
LOGIC
to Digital Common . . . . . . . . . . . . . . . . . . 0 V to +7 V
Analog Common to Digital Common . . . . . . . . . . . . . . . ±1 V
Control Inputs (CE,
CS, A
O
12/8, R/C) to
Digital Common . . . . . . . . . . . . . . –0.5 V to V
LOGIC
+ 0.5 V
Analog Inputs (REF IN, BIP OFF, 10 V
IN
) to
Analog Common . . . . . . . . . . . . . . . . . . . . . . . . .V
EE
to V
CC
20 V
IN
to Analog Common . . . . . . . . . . . . . . . . . . . . . . ±24 V
REF OUT . . . . . . . . . . . . . . . . . . Indefinite Short to Common
Momentary Short to V
CC
Chip Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . .825 mW
Lead Temperature (Soldering, 10 sec). . . . . . . . . . . . . +300°C
Storage Temperature (Ceramic) . . . . . . . . . .–65°C to +150°C
(Plastic) . . . . . . . . . . . . . . . . . . . . . . . . . . .–25°C to +100°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.