Datasheet

AD5735 Data Sheet
Rev. C | Page 48 of 48
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
0.25 MIN
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50 REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
SEATING
PLANE
PIN 1
INDICATOR
7.25
7.10 SQ
6.95
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
9.10
9.00 SQ
8.90
8.85
8.75 SQ
8.65
06-13-2012-C
Figure 86. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Resolution (Bits) Temperature Range Package Description Package Option
AD5735ACPZ 12 −40°C to +105°C 64-Lead LFCSP_VQ CP-64-3
AD5735ACPZ-REEL7 12 −40°C to +105°C 64-Lead LFCSP_VQ CP-64-3
1
Z = RoHS Compliant Part.
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D09961-0-11/12(C)