Datasheet

AD5722/AD5732/AD5752
Rev. D | Page 30 of 32
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-ADT
061708-A
24
13
121
6.40 BSC
0.15
0.05
0.10 COPLANARITY
TOP VIEW
EXPOSED
PAD
(Pins Up)
BOTTOM VIEW
4.50
4.40
4.30
7.90
7.80
7.70
1.20 MAX
1.05
1.00
0.80
0.65
BSC
0.30
0.19
SEATING
PLANE
0.20
0.09
8°
0°
0.75
0.60
0.45
5.02
5.00
4.95
3.25
3.20
3.15
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 45. 24-Lead Thin Shrink Small Outline Package, Exposed Pad [TSSOP_EP]
(RE-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Resolution (Bits) Temperature Range INL TUE (% FSR) Package Description Package Option
AD5722AREZ 12 −40°C to +85°C ±1 LSB ±0.3 24-Lead TSSOP_EP RE-24
AD5722AREZ-REEL7 12 −40°C to +85°C ±1 LSB ±0.3 24-Lead TSSOP_EP RE-24
AD5732AREZ 14 −40°C to +85°C ±4 LSB ±0.3 24-Lead TSSOP_EP RE-24
AD5732AREZ-REEL7 14 −40°C to +85°C ±4 LSB ±0.3 24-Lead TSSOP_EP RE-24
AD5752AREZ 16 −40°C to +85°C ±16 LSB ±0.3 24-Lead TSSOP_EP RE-24
AD5752AREZ-REEL7 16 −40°C to +85°C ±16 LSB ±0.3 24-Lead TSSOP_EP RE-24
1
Z = RoHS Compliant Part.