Datasheet

Data Sheet AD5696/AD5694
Rev. A | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 5.
Parameter Rating
V
DD
to GND −0.3 V to +7 V
V
LOGIC
to GND −0.3 V to +7 V
V
OUT
to GND −0.3 V to V
DD
+ 0.3 V
V
REF
to GND −0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to GND
1
−0.3 V to V
LOGIC
+ 0.3 V
SDA and SCL to GND −0.3 V to +7 V
Operating Temperature Range
−40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 125°C
Reflow Soldering Peak Temperature,
Pb Free (J-STD-020)
260°C
ESD
Human Body Model (HBM) 3.5 kV
Field-Induced Charged Device
Model (FICDM)
1.5 kV
1
Excluding SDA and SCL.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. This
value was measured using a JEDEC standard 4-layer board with
zero airflow. For the LFCSP package, the exposed pad must be
tied to GND.
Table 6. Thermal Resistance
Package Type θ
JA
Unit
16-Lead LFCSP 70 °C/W
16-Lead TSSOP 112.6 °C/W
ESD CAUTION