Datasheet
Table Of Contents
- Features
- Applications
- Functional Block Diagram
- General Description
- Product Highlights
- Table of Contents
- Specifications
- Absolute Maximum Ratings
- Pin Configurations and Function Descriptions
- Typical Performance Characteristics
- Terminology
- Theory of Operation
- Digital-to-Analog Converters
- Transfer Function
- DAC Architecture
- Serial Interface
- Standalone Operation
- Write and Update Commands
- Daisy-Chain Operation
- Readback Operation
- Power-Down Operation
- Load DAC (Hardware /LDAC Pin)
- Mask Register
- Hardware Reset (/RESET)
- Reset Select Pin (RSTSEL)
- Internal Reference Setup
- Solder Heat Reflow
- Long-Term Temperature Drift
- Thermal Hysteresis
- Applications Information
- Outline Dimensions

Data Sheet AD5689R/AD5687R
Rev. 0 | Page 9 of 28
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 6.
Parameter Rating
V
DD
to GND −0.3 V to +7 V
V
LOGIC
to GND −0.3 V to +7 V
V
OUT
to GND −0.3 V to V
DD
+ 0.3 V
V
REF
to GND −0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to GND −0.3 V to V
LOGIC
+ 0.3 V
Operating Temperature Range −40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature 125°C
16-Lead TSSOP, θ
JA
Thermal Impedance,
0 Airflow (4-Layer Board)
112.6°C/W
16-Lead LFCSP, θ
JA
Thermal Impedance,
0 Airflow (4-Layer Board)
70°C/W
Reflow Soldering Peak Temperature,
Pb Free (J-STD-020)
260°C
ESD
1
4 kV
FICDM 1.5 kV
1
Human body model (HBM) classification.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION