Datasheet

Data Sheet AD5686/AD5684
Rev. A | Page 9 of 28
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 6.
Parameter Rating
V
DD
to GND −0.3 V to +7 V
V
LOGIC
to GND −0.3 V to +7 V
V
OUT
to GND −0.3 V to V
DD
+ 0.3 V
V
REF
to GND −0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to GND −0.3 V to V
LOGIC
+ 0.3 V
Operating Temperature Range −40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature 125°C
16-Lead TSSOP, θ
JA
Thermal
Impedance, 0 Airflow (4-Layer Board)
112.6°C/W
16-Lead LFCSP, θ
JA
Thermal
Impedance, 0 Airflow (4-Layer Board)
70°C/W
Reflow Soldering Peak
Temperature, Pb Free (J-STD-020)
260°C
ESD
HBM
1
4 kV
FICDM 1.5 kV
1
Human body model (HBM) classification.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION