Datasheet

AD5628/AD5648/AD5668 Data Sheet
Rev. G | Page 28 of 32
2.70
2.60 SQ
2.50
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGC.
1
0.65
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
0.45
0.40
0.35
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
08-16-2010-C
Figure 64. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-17)
Dimensions shown in millimeters
10-23-2012-A
A
B
C
D
0.650
0.595
0.540
SIDE VIEW
0.270
0.240
0.210
0.340
0.320
0.300
COPLANARITY
0.05
SEATING
PLANE
12
3
4
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
BALL A1
IDENTIFIER
0.50
REF
1.50
REF
2.645
2.605 SQ
2.565
Figure 65. 16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16-16)
Dimensions shown in millimeters